{"created":"2024-12-12T09:55:28.440977+00:00","id":2011155,"links":{},"metadata":{"_buckets":{"deposit":"ae97525d-cdd2-4478-9d2e-c98e7748d434"},"_deposit":{"created_by":7,"id":"2011155","owners":[7],"pid":{"revision_id":0,"type":"depid","value":"2011155"},"status":"published"},"_oai":{"id":"oai:tokushima-u.repo.nii.ac.jp:02011155","sets":["1713853213384:1713853295607"]},"author_link":["1425"],"item_10001_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2022-01-20","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"3","bibliographicPageEnd":"192","bibliographicPageStart":"189","bibliographicVolumeNumber":"34","bibliographic_titles":[{"bibliographic_title":"IEEE Photonics Technology Letters","bibliographic_titleLang":"en"}]}]},"item_10001_description_5":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"We have developed a silicon photonics receiver integrated with a SiGe-BiCMOS linear transimpedance amplifier (TIA) using the flip-chip bonding technology to assist in resolving the I/O bottleneck problem in inter-chip data communication. The proposed device demonstrated optical 112 Gb/s four-level pulse amplitude modulation (PAM-4) operations and clear eye openings without any equalization for the pseudorandom binary sequence 215 – 1 signal. The 3 dB bandwidth and transimpedance gain were designed to be 37.1 GHz and 60.1 dBΩ, respectively, at a supply voltage of 3.3 V. The consumption current of the linear TIA was 95.1 mA, and it resulted in a power consumption of 314 mW (2.8 pJ/bit). A linear TIA circuit is a key technology for PAM-4 operation; therefore, we discussed the linearity of our receiver response through eye diagrams and simulation. The measured eye diagrams agreed with the simulation results, and the proposed device maintained a linear response for up to 450 μAp-p input current. In addition, its operation rate of 112 Gb/s is the highest operation rate reported for a silicon photonics PAM-4 receiver based on flip-chip 3D integration with a germanium photodetector and a SiGe-BiCMOS linear TIA.","subitem_description_language":"en","subitem_description_type":"Abstract"}]},"item_10001_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"IEEE","subitem_publisher_language":"en"}]},"item_10001_rights_15":{"attribute_name":"権利情報","attribute_value_mlt":[{"subitem_rights":"© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.","subitem_rights_language":"en"}]},"item_10001_source_id_9":{"attribute_name":"収録物ID","attribute_value_mlt":[{"subitem_source_identifier":"10411135","subitem_source_identifier_type":"ISSN"},{"subitem_source_identifier":"19410174","subitem_source_identifier_type":"ISSN"},{"subitem_source_identifier":"AA10681067","subitem_source_identifier_type":"NCID"}]},"item_10001_version_type_20":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_ab4af688f83e57aa","subitem_version_type":"AM"}]},"item_1715043197608":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"open access"}]},"item_1722929371688":{"attribute_name":"出版社版DOI","attribute_value_mlt":[{"subitem_relation_name":[{"subitem_relation_name_language":"ja","subitem_relation_name_text":"10.1109/LPT.2022.3144985"}],"subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1109/LPT.2022.3144985","subitem_relation_type_select":"DOI"}}]},"item_1723180141928":{"attribute_name":"EID","attribute_value_mlt":[{"subitem_identifier_type":"URI","subitem_identifier_uri":"398610"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"オカモト, ダイスケ","creatorNameLang":"ja"},{"creatorName":"オカモト, ダイスケ","creatorNameLang":"ja-Kana"},{"creatorName":"Okamoto, Daisuke","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"スズキ, ヤスユキ","creatorNameLang":"ja"},{"creatorName":"スズキ, ヤスユキ","creatorNameLang":"ja-Kana"},{"creatorName":"Suzuki, Yasuyuki","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"タケムラ, コウイチ","creatorNameLang":"ja"},{"creatorName":"タケムラ, コウイチ","creatorNameLang":"ja-Kana"},{"creatorName":"Takemura, Koichi","creatorNameLang":"en"}]},{"creatorAffiliations":[{"affiliationNameIdentifiers":[{"affiliationNameIdentifier":"","affiliationNameIdentifierScheme":"ISNI","affiliationNameIdentifierURI":"http://www.isni.org/isni/"}],"affiliationNames":[{"affiliationName":"","affiliationNameLang":"ja"}]}],"creatorNames":[{"creatorName":"藤方, 潤一","creatorNameLang":"ja"},{"creatorName":"フジカタ, ジュンイチ","creatorNameLang":"ja-Kana"},{"creatorName":"Fujikata, Jun-ichi","creatorNameLang":"en"}],"familyNames":[{"familyName":"藤方","familyNameLang":"ja"},{"familyName":"フジカタ","familyNameLang":"ja-Kana"},{"familyName":"Fujikata","familyNameLang":"en"}],"givenNames":[{"givenName":"潤一","givenNameLang":"ja"},{"givenName":"ジュンイチ","givenNameLang":"ja-Kana"},{"givenName":"Jun-ichi","givenNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"1425","nameIdentifierScheme":"WEKO"},{"nameIdentifier":"374816/profile-ja.html","nameIdentifierScheme":"徳島大学 教育研究者総覧","nameIdentifierURI":"http://pub2.db.tokushima-u.ac.jp/ERD/person/374816/profile-ja.html"},{"nameIdentifier":"00869159","nameIdentifierScheme":"e-Rad","nameIdentifierURI":"https://nrid.nii.ac.jp/ja/search/?qm=00869159"}]},{"creatorNames":[{"creatorName":"ナカムラ, タカヒロ","creatorNameLang":"ja"},{"creatorName":"ナカムラ, タカヒロ","creatorNameLang":"ja-Kana"},{"creatorName":"Nakamura, Takahiro","creatorNameLang":"en"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_access","date":[{"dateType":"Available","dateValue":"2024-01-20"}],"displaytype":"detail","filename":"ptl_34_3_189.pdf","filesize":[{"value":"727 KB"}],"format":"application/pdf","mimetype":"application/pdf","url":{"objectType":"fulltext","url":"https://tokushima-u.repo.nii.ac.jp/record/2011155/files/ptl_34_3_189.pdf"},"version_id":"5a9ccaf0-7940-4925-bfe7-0d9418fcf348"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Linear amplifier","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"optical interconnects","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"optical receivers","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"optoelectronic integrated circuit","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"PAM-4","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"SiGe-BiCMOS","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"silicon photonics","subitem_subject_language":"en","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"112 Gb/s PAM-4 Silicon Photonics Receiver Integrated With SiGe-BiCMOS Linear TIA","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"112 Gb/s PAM-4 Silicon Photonics Receiver Integrated With SiGe-BiCMOS Linear TIA","subitem_title_language":"en"}]},"item_type_id":"40001","owner":"7","path":["1713853295607"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2023-07-27"},"publish_date":"2023-07-27","publish_status":"0","recid":"2011155","relation_version_is_last":true,"title":["112 Gb/s PAM-4 Silicon Photonics Receiver Integrated With SiGe-BiCMOS Linear TIA"],"weko_creator_id":"7","weko_shared_id":-1},"updated":"2025-02-12T00:14:56.691553+00:00"}